TSMC foundry Investor Conference held on 18 May, attended by the chairman Morris Chang said France next few quarters will analyze supply chain inventory situation and explain TSMC 20-nanometer and 16-nanometer production schedule. TSMC is expected in February 2014 for 20-nanometer production, 20nm proportion of total revenue in 2014 is expected to reach the high single-digit (high single digit), while also actively TSMC 16 nm process development expected 16 nm in April 2015 for mass production.
TSMC to benefit from mobile computing equipment in the field of 28 nanometer chips strong demand during the first half of 2013 to produce brisk sales and earnings transcripts, however, with the integration of components plant (IDM) factory Intel (Intel) and Samsung ( Samsung) actively into the field of foundry, foundry is only open in the past (foundry) Factory competitive situation, Chang said the law will be directed in the future will no longer be competing foundries, but Integration Component Factory also put battlefield into a new era of competition.
Dr. Morris Chang, TSMC helmsman
TSMC's advanced process layout, promising below 20 nm, and actively cut new process areas
Following the end of 2011, TSMC's 28 nm into mass production, TSMC process will advance in early 2014 to 20 nm TSMC 18 from France, said in the show's photos, Tainan plant Fab14 P5 plant (20 nm process) will mass production in February 2014, while the Fab14 P6 plant will be in volume production in May the same year, Chang pointed out that the 20-nanometer production in the first year of revenue will reach high single-digit level (high single digit), and that, TSMC 20-nanometer process faces competitive pressure is relatively small.
On the other hand, is also active layout TSMC 16-nanometer process, can be seen from the figure TSMC F14 P7 plant (16 nm process) in April 2015 for mass production, with a clear blueprint for Intel's 14 nanometer , coupled with Samsung choose to skip the 20-nanometer process, advancing directly to the manufacturing process to 14 nanometers, Chang also admitted into the 16-nanometer process, the competitive situation will change, 16-nanometer competitors include Intel, Samsung and Gro Pfund (Global Foundry), the face of on-site foreign inquiry, TSMC 16 nanometer chip size than the competitor's 14 nanometer fear large size, performance is also poor, Chang places "are currently not seen stuff" retorted .
TSMC's Tainan plant Fab14 P5
TSMC's Tainan plant Fab14 P6
TSMC's Tainan plant Fab14 P7
From the above chart we can see that side of the park in Tainan, Taiwan Semiconductor Manufacturing Company's strategic importance is high, a lot of advanced processes in addition to the factory in Hsinchu and Taichung plant, the scale of investment in the plant in Tainan is also substantial.
From the point of view of TSMC's technology roadmap, TSMC is expected in 2014 for 20-nanometer production, followed in 2015 for 16-nanometer production, next generation manufacturing process life cycle (Cycle) will be shortened, Chang admits , 20-nanometer 28 nm shorter than the life cycle, he stressed, 20 nm and 28 nm lifecycle than 28nm long.
TSMC's 20-nanometer and 28 nanometer optimistic life cycle than 28nm long
Look in the second half from the upstream semiconductor boom
Enter the second half of 2013, TSMC as Taiwan's semiconductor industry's first law says that it will also officially in 2013 set the tone for the second half of semiconductors, TSMC will continue to have the third quarter of 3.3% -5.2% of the quarter by the performance, however, the market many believe that TSMC's third quarter outlook lower than originally expected, but also in France, said Chang described the current inventory levels will be higher than the original estimate of conditions, is expected to force the fourth quarter inventory correction will increase, therefore, in the fourth quarter will be similar to 2012, except for the fourth quarter to force inventory enhancements probably will increase the rate of decline.
